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Die Brush & Foam Pad for Wafer-Thin Dies

Die Brush & Foam Pad for Wafer-Thin Dies

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SKU: SIZ 660513
When it comes to removing excess paper in all brands of wafer-thin, chemically-etched dies, the Sizzix Die Brush does it easily and ergonomically. With a sleek, ergonomic rubber-grip handle for non-slippage and easy maneuverability, the Die Brush easily rolls away excess paper to reveal the perfect cut! The Die Brush includes a Foam Pad that acts as the perfect work surface for removing excess paper from the dies and even the cutout.
AED 54.00

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Product Description

    Details

    Specifications: Product Dimensions - Die Brush: 5 1/2" x 1 3/4" x 1/4". Foam Pad: 4 1/2" x 7 1/4". Includes - 1 Die Brush, 1 Foam Pad
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