Delivery Times
may take longer than usual Due to current COVID-19 situation

Die Brush & Foam Pad for Wafer-Thin Dies

Die Brush & Foam Pad for Wafer-Thin Dies

Be the first to review this product

SKU: SIZ 660513
When it comes to removing excess paper in all brands of wafer-thin, chemically-etched dies, the Sizzix Die Brush does it easily and ergonomically. With a sleek, ergonomic rubber-grip handle for non-slippage and easy maneuverability, the Die Brush easily rolls away excess paper to reveal the perfect cut! The Die Brush includes a Foam Pad that acts as the perfect work surface for removing excess paper from the dies and even the cutout.
AED 54.00

All prices include VAT 

Product Description


    Specifications: Product Dimensions - Die Brush: 5 1/2" x 1 3/4" x 1/4". Foam Pad: 4 1/2" x 7 1/4". Includes - 1 Die Brush, 1 Foam Pad
Additional Information

    Additional Information

    SKU SIZ 660513
Product's Review

    Write Your Own Review

    You're reviewing: Die Brush & Foam Pad for Wafer-Thin Dies

    How do you rate this product? *

    1 1 star
    2 2 star
    3 3 star
    4 4 star
    5 5 star
Product Tags

    Use spaces to separate tags. Use single quotes (') for phrases.

CMS tab